![]() ![]() Major topics include:flex attachment,board-in-board,part-on-part,both lead-free and tin-lead criteria,component orientation and soldering criteria for through hole,SMT, cleaning, marking, coating and laminate requirements.IPC-A-610 is invaluable for all inspectors, operators and trainers. ![]() Additionally, wherever possible statements were modified to make readability easier and to enhance understanding - all without eleminating any requirements. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. Full Description IPC-A-610 is the most widely used electronics assembly standard in the world.
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